Soft thermally conductive pads provide excellent thermal transfer even with limited contact pressure.THERM-A-GAP HCS10 and the THERM-A-GAP 5XX series from Parker Chomerics conform completely to the interfaces and, with only a limited contact pressure force, push out any air bubbles still present between the interfaces. Thus, multiple components can be cooled with only one pad or larger tolerances can be accommodated when cooling to an enclosure, for example.
The materials can be supplied on a backing of glass fiber or aluminum, the latter of which is also available with an adhesive layer. The material is somewhat sticky by itself which makes application very easy.
Typically, these materials are found in telecommunications equipment, consumer electronics, automotive,space and aerospace, (LED) lighting, power electronics,mobile devices and anywhere where excess heat must be controlled and maximally dissipated.
INFORMATION CHO92