Thermal management Thermal management (electronics)

Innovative high performance cooling profile

Seifert Electronic has the patented high performance Vario series, which provides much more cooling capacity per volume. This fin cooling profile is constructed from individual fins that are pressed together with a crease joint at the factory. By building the profile from individual fins, the effective cooling surface can be greatly increased compared to standard extrusion profiles. An exceptionally wide range of dimensions can be manufactured.

Once the fins have been pressed together, a flat base is created on which the component to be cooled can be mounted. For this purpose, the base can be provided with the necessary mounting holes.

There are slats in a double version of 62.5mm, 84.8mm, 92.5mm and 117mm height and a single version in 75.5mm height. The length can be cut between 50mm and a maximum of 500mm, while the pressed width can range from 50mm to a maximum of 350mm.

Additional information

Interested or more information?

Do you have any questions or interest in this product? Please fill out the form below and we will contact you as soon as possible.

  • This field is for validation purposes and should not be changed.

Do you have questions about our products or are you looking for a specific product?

Feel free to contact us our staff is at your service.