With the acquisition of Swedish Webra, Seifert Electronic has brought skiving technology in-house. This technology offers engineers new design freedom where conventional heatsinks fall short. Seifert's Flexfin Skiving heatsinks are manufactured from a single piece of material - without glue, solder or mechanical connections. This creates a thermally homogeneous structure with optimal heat conduction.
In skiving, fins are "peeled" directly from a solid block of aluminum or copper. This prevents contact resistance between fin and base. Aluminum EN AW-1060 or EN AW-6063 with a thermal conductivity of up to 230 W/mK is used as the base material; for extremely high power applications, copper Cu110) can also be used.
Thanks to the direct connection between base and fins, Flexfin heat sinks are not only more efficient, but also lighter and more durable. The one-piece construction does not have the disadvantages of loosening fins and aging connecting materials.
The technology also offers great design freedom:
- koelprofiel breedte <1000mm
- koelprofiel lengte <500mm
- fin height from 3-140 mm
- fin spacing of 0.3-6.5 mm
- base thickness up to 30 mm
For thermally demanding applications such as high power modules, power electronics or thermoelectric systems, skiving offers an attractive alternative. Moreover, even small series and prototypes can be realized quickly without expensive tooling costs.
